The design and manufacture of modern aerospace and defense (A&D) systems is becoming increasingly challenging as technology advances and threats become more complex. Additional functionality, such as electronic warfare (EW) and secure communications, is becoming necessary across more military systems. However, these advanced features require increasingly complex subcomponents, which can grow the size of the system. Shrinking applications on drones, satellites, and other miniature systems cannot tolerate larger sizes. To help customers create practical solutions that meet more aggressive requirements, Benchmark employs a manufacturing approach for defense applications that harnesses engineering and manufacturing equipment, experience, and skills. Our engineering teams work closely with customers to help turn the most advanced and sophisticated designs into practical solutions. With automated robotic manufacturing, circuit densification, and artificial intelligence, this approach readies advanced A&D designs for cost-effective production while ensuring the product meets all requirements.
Advanced Capabilities for Complex Manufacturing Challenges
Aided by machine learning (ML) technologies and automated optical inspection (AOI), Benchmark's A&D manufacturing approach packs more performance into smaller hardware sizes. It can miniaturize printed circuit boards (PCBs) that use microwave and millimeter wave frequencies for RF applications using the tight spacings afforded by high-density interconnections (HDIs), backed by extensive design knowledge and experience in automated assembly and test.
These systems can be engineered and manufactured for a wide range of A&D applications, including advanced signal processing and electronic warfare. The A&D manufacturing approach has helped deliver circuits and systems at RF, microwave, and millimeter wave frequencies at high data rates to provide the communications security needed for the most demanding modern A&D systems. In addition, experience with frequency spectrum management and spectrum denial techniques such as jamming helps support the development of compact spectrum management solutions. As A&D applications and systems evolve, they require tight integration of advanced technologies that must work together flawlessly and continuously.
Industry-Leading Expertise for Competitive Outcomes
Benchmark's multifaceted manufacturing approach helps customers meet or exceed the most challenging requirements for reducing the size, weight, and power (SWaP) of A&D products. It employs proven design and manufacturing capabilities, including active component embedding, conductive trace printing, and RF/microwave microelectronics, to achieve increased functionality in smaller modules and system sizes.
Benchmark's approach always considers compliance with applicable industry standards and employs a supply chain with minimal disruptions for each A&D component, even in volatile markets. Integrated use of agile production management software within the A&D manufacturing approach enables consistent and cost-effective production of complex electronic systems. Benchmark manufactures sophisticated systems according to MIL-STD certifications and ITAR standards.
Command of specific technologies, such as HDIs, makes it possible to shrink the sizes and weights of EW modules and subsystems for ease of integration on unmanned aerial vehicles (UAVs) where small size is critical. In addition, the development of such a wide range of technologies according to rigorous standards enables smaller, lightweight applications, including EW and secure communications systems capable of handling wide temperature ranges and hostile operating environments without compromising for small size.
For example, Benchmark can implement smaller, lighter circuits that support higher data rates through advanced thermal management. Normally, high data rates would raise the operating temperatures of circuit transmission lines to levels jeopardizing long-term reliability. But by exploring and understanding different thermal management techniques, such as advanced circuit materials, heat sinks, or even liquid cooling systems, Benchmark's engineers can work closely with customers to reach their electrical and mechanical goals even under challenging thermal conditions.
Automating Production
Advanced manufacturing processes serving A&D customers' varying needs require capabilities for compliance with applicable standards in the most cost-effective way possible. This includes having the equipment and experience for adapting flexible robotic assembly and test equipment to existing and emerging applications, such as EW and secure communications systems. Experience in automating the production of RF/microwave designs, for example, has taught Benchmark the power of applying robotic solutions to automated manufacturing and production testing.
Integrating AOI equipment and techniques within the production line, for example, can help shorten the manufacturing time for a complex A&D product, avoid or minimize performance failures, and boost product yields due to mechanical defects. AOI, for example, can check the mechanical quality of a PCB by examining the surface roughness of the PCB's copper foil. Benchmark's A&D manufacturing approach liberally integrates programmable test and measurement equipment in pursuit of consistent manufacturing production.
Customer Camaraderie
Of course, the most well-conceived and practiced manufacturing methods would mean little without the teamwork of thoughtful customers. Working closely with customers, Benchmark can transform complex A&D concepts into realities. Through steady feedback loops with their customers, Benchmark can prepare or even adapt complex prototypes into production units well suited for automated, cost-effective manufacturing.
New specifications often drive Benchmark's customers to provide higher performance levels in smaller, lighter packages. Achieving such goals requires densely configured electronic designs that function reliably in hostile operating environments. By working closely with their customers, Benchmark tries to fill any design gaps in a prototype that might hinder effective automated manufacturing of that unit. They do so with the experience and expertise needed for success in an often-crowded frequency spectrum subject to electromagnetic interference (EMI) conditions and wide temperature fluctuations in hostile operating environments. Teaming tightly with customers helps unveil design challenges that the team must overcome on the way to automated manufacturing.
As an example of close collaboration with customers, a component not always associated with miniaturization, the atomic clock, was highlighted in a Case Study from Benchmark (see "Collaborative Development of a Chip-Sized Atomic Clock"). Working with Benchmark's Rochester, MN team, a large defense customer teamed with Benchmark to develop a chip-scale atomic clock with extremely low power consumption for DARPA. By using microelectromechanical systems (MEMS) technology, a technique that takes advantage of existing semiconductor fabrication technology to fabricate microscopic electromechanical components, the team developed a tiny atomic clock with excellent performance for its miniature size. Benchmark's team brought creativity to the development and manufacturing procedure by rethinking several atomic clock components to suit the MEMS format.
Miniaturizing the atomic clock is just one example of teamwork with a customer to provide benefits for A&D applications and many other markets. By refining its A&D manufacturing approach with tools like robotic assembly, extensive status monitoring, and built-in-test-equipment (BITE) integrated into the production line, Benchmark teams with customers to enhance critical A&D applications such as EW systems and secure communications equipment. By exploring and adding the latest technologies, such as additive manufacturing with three-dimensional (3D) printing, Benchmark continues to enhance the capabilities of its A&D manufacturing approach and to find ways to work closely with its customers in meeting their most challenging requirements.
