We Rewrote The Rules For SWaP Optimization

Benchmark uses a variety of strategies to help customers like you overcome size, weight, and power challenges. No matter which tools we use, the outcome is the same: a product optimized for how it will be used, not limited by the electronics it contains.

Optimizing New or Existing Designs

Our electrical and mechanical engineers work to ensure the electronics fit within that form factor. We design for size and manufacturability, ensuring that the transition from design to manufacturing is seamless. Our complete lifecycle management services support your product even after manufacturing and innovation for the next version. Our engineering toolkit includes methods for reducing the size of electronics, allowing us to select the best approach to reach your miniaturization goals.

Miniaturization Capabilities
  • High Density Interconnect (HDI) circuit board design
  • Integrated thermal management features for high-density designs, developed on the latest thermal modeling software
  • Solutions for a wide range of RF frequencies without crosstalk
  • Hybrid micro-e and SMT assemblies
  • Design for optimal size, form, and manufacturing

Let's Innovate Together

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