Benchmark Markets

Engineering, manufacturing, and technology solutions for markets that demand high-reliability.
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Our vision is to positively impact lives by solving complex challenges with our customers, creating innovative products that no one imagined were possible.
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MINIATURIZATION

WE REWROTE THE RULES OF SWaP OPTIMIZATION

Benchmark helps our partners overcome technological limitations with our expertise in multiple methods of electronics miniaturization. Our engineering toolkit includes multiple methods for reducing the size of electronics optimized for various use cases, allowing us to select the best method to reach the customer’s miniaturization goals. Our advanced manufacturing techniques expand design options available by enabling narrower lines and spaces, repartitioning of printed circuit boards to combine components, and flexible substrates for thinner multi-layer boards. We can then manufacture our designs using our capabilities in circuit fabrication, microelectronics, SMT, or even hybrid electronics. No matter which tools we use, the outcome is the same: a product that is optimized for how it will be used, not limited by the electronics it contains.

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Markets Served

Commercial Aerospace

Computing & Data Center

Medical

Nextgen Telco

Defense

YOUR TECHNOLOGY PARTNER FOR SMALLER ELECTRONICS

When size, weight, and power (SWaP) challenges are the main obstacle to the success of your design, Benchmark works with your engineering team to find an optimal solution. Our co-located engineering and manufacturing for miniaturized circuits gives customers access to a world-class engineering team experienced in working with the expanded design parameters made possible by our manufacturing processes. This engineering and manufacturing combination allows us to achieve high-density interconnect (HDI) circuit topologies in high-layer count boards known as 3-dimensional heterogeneous integrated (3DHI) circuits. Our manufacturing processes can create 3DHI circuits with 25 micron lines and spaces for the smallest total electronics package. True 3DHI circuits give our customers a wide set of new options in electronics partitioning, allowing the combination of previously separate components to drastically reduce overall electronics footprint. Our ability to create 3DHI circuits using high-performance, low-loss substrates like liquid crystal polymer (LCP), creates solutions for a wide range of RF frequencies without crosstalk.

Benchmark also has decades of experience miniaturizing electronics designs for micro-e and even traditional SMT assembly. We start with award-winning industrial design to arrive at the optimal form factor for an application, then our electrical and mechanical engineers work to ensure the electronics fit within that form factor. We design not only for size, but also manufacturability, ensuring that the transition from design to manufacturing is seamless. Our complete lifecycle management services continue to support a product after manufacturing and innovate for the next version.

Problems solved by miniaturization:

  • Size, weight, and power (SWaP) reductions that can reduce overall device size and increase performance
  • Electronics that fit into optimal form factors for a device
  • Repartitioning of electronics components to reduce size, increase reliability, and decrease costs

Benchmark’s capabilities include:

  • Overall size reductions of more than 60 percent over conventional circuit production methods
  • Circuits with 25 micron lines and traces in boards of 10+ layers using 3-dimensional heterogeneous integrated (3DHI) topologies
  • Unique capabilities in liquid crystal polymer (LCP) for 3DHI circuits that are flexible and near-hermetically sealed
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White Paper: Circuit Miniaturization Using Liquid Crystal Polymer

This white paper explains advanced circuit fabrication methodologies for circuits with sub-25 micron lines and traces in more than 10 layers using Liquid Crystal Polymer.

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CASE STUDY: MINIATURIZING RF COMPONENTS

Benchmark Lark Technology used advanced circuit fabrication techniques to create surface mountable RF filters that perform up to 40GHz with a significant reduction in size and weight.

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