Benchmark Markets

    Engineering, manufacturing, and technology solutions for markets that demand high-reliability.
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    About

    Our vision is to positively impact lives by solving complex challenges with our customers, creating innovative products that no one imagined were possible.
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    Investors

    Bridging the gap between innovation and marketability
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    Connect

    Your full solution partner of choice
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    Precision Technologies

    From analytics to prototypes, precision engineering to production, assembly to supply chain management, our global team provides premier experience and complex machining.
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    Connected Device Technology

    A flexible development team for connected devices that collect relevant, reliable data for smart city, medical, and complex industrial applications.
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    Lark TechnologyDiscover a different type of magicBuy now
    Secure TechnologySecure lab tested technology, with battle-tested durability
    Precision Technologies Hone in on agility and accuracy
    Connected TechnologyDevelop custom connected devices

    MICROELECTRONICS

    Built To Perform,
    Not Just To Print

    In microelectronics assembly, there’s no room for error. That’s why we built our global microelectronics capabilities around cutting-edge production tools and highly experienced teams—allowing us to provide reliable, high-tech manufacturing and engineering solutions for the most highly regulated markets.

    Markets Served

    COMMERCIAL AEROSPACE
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    COMPLEX INDUSTRIAL
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    HIGH PERFORMANCE COMPUTING
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    DEFENSE
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    MEDICAL TECHNOLOGIES
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    NEXTGEN TELCO
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    MIXED AND HYBRID TECHNOLOGY MODULES AND ASSEMBLIES

    Benchmark Phoenix site co-locates precision microelectronic assembly capabilities with design engineering and Surface Mount Technology (SMT) capabilities, overcoming your size, weight, and power (SWaP) challenges. We excel at developing microelectronics processes for RF systems, particularly at challenging millimeter-wave (mmWave) frequencies. On-site photonics expertise supports the development of photonics test, assembly, and packaging solutions. This combination makes Benchmark the partner of choice for mixed-technology applications in defense, telecommunications, and high-performance computing.

    Sites are optimized for low-volume/high mix to medium-volume production. All sites offer numerous certifications and registrations.

    ADVANCED CAPABILITIES
    • Microelectronics assembly, automation, and test engineering services from one provider
    • Microelectronic packaging capabilities for a wide range of ceramic and open-cavity plastic packages, including System-in-Package (SiP) applications
    • Broad microelectronics bonding and attachment capabilities
    • Customized automated processing for high production volumes
    • Advanced testing and failure analysis capabilities using 2D and 3D x-ray inspection and scanning electron microscopy
    • Precision optical alignment

    Additional Resources

    OUSTER LIDAR CASE STUDY

    When a leading provider of high-resolution, low-cost lidar sensors was ready to scale, they turned to Benchmark.

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    HYBRID ASSEMBLY CASE STUDY

    Benchmark improved yields on complex microelectronics and SMT assembly for aerospace and defense application.

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    ATOMIC CLOCK CASE STUDY

    Benchmark helped our partner manufacture a groundbreaking miniaturized design.

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    Ready to tackle your smallest challenges?
    Our mission is to be our customers’ trusted partner; providing comprehensive solutions across the entire product lifecycle; leading through our innovative technology and engineering design services; leveraging our optimized global supply chain; and delivering world-class manufacturing services.

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