Benchmark Markets

Engineering, manufacturing, and technology solutions for markets that demand high-reliability.
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MICROELECTRONICS

Expertise for microelectronics built to perform, not just built to print

Benchmark knows there’s no room for error when it comes to microelectronics assembly. That’s why the company built global microelectronics capabilities around not only the most advanced production tools, but also highly experienced teams with deep knowledge of specific microelectronics applications, process design and automation, and advanced test procedures. The result is reliable, high-tech manufacturing and engineering solutions for the most highly-regulated markets.

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Markets Served

Nextgen Telco

Commercial Aerospace

Defense

Medical

Complex Industrial

Computing Data-Center

Optimized for the needs of high-reliability markets

Microelectronics assembly is a diverse topic that covers many different customer needs depending on industry and product. Benchmark has optimized each microelectronics production facilities to suit different microelectronics requirement sets. This gives the company's microelectronics teams deep expertise in optical alignment, medical devices, radio frequency (RF) and microwave systems, space systems, electronic warfare, and photonics applications.

Benchmark’s microelectronics assembly offers high precision automated die attach and wire bonding processes. On-site engineering expertise allows the company to troubleshoot problems and work alongside our customers to improve production processes. In addition, Benchmark combines expertise in microelectronics with complete product lifecycle management, from product design through assembly to supply chain and aftermarket services, creating a one-partner solution for complex products.

Benchmark is a leader in microelectronics for medical devices. The company's years of experience in medical device and optics engineering facilitates the design and build of cutting-edge medical microelectronics products with customers. Microelectronics capabilities are combined with extensive test and process development capabilities, as well as on-site surface-mount technology (SMT) capabilities for complete system production. Benchmark offers microelectronics manufacturing in facilities that are FDA compliant and MedAccred accredited.

For advanced aerospace, defense, computing, and telecommunication systems, Benchmark co-locates precision microelectronic assembly capabilities with very high density interconnect (VHDI) circuit fabrication, including design engineering and fabrication of 3-dimensional heterogeneous integration (3DHI) structures that can solve challenging RF and size, weight, and power (SWaP) challenges. Sites offer numerous certifications and registrations, including ITAR and AS9100. On-site SMT, system build, test, and aftermarket solutions offer complete system production from one partner.

For higher production volumes, Benchmark offers customized automated processing in microelectronics to achieve optimal cost and production volume goals. Combing advanced microelectronics process engineering with extensive additional manufacturing capabilities including SMT and system build on-site, Benchmark provides complete system services for higher-volume production of telecommunications, computing, medical and complex industrial products.

Problems solved by microelectronics:

  • The need for reliable, precision electronics when size is a major constraint
  • Very complex products that require the combination of SMT, optical alignment, and other capabilities for very complex products
  • A wide-range of regulatory and certification requirements for U.S.-based 

Benchmark's capabilities include:

  • State-of-the-art SMT assembly, automation, and test engineering services in one location
  • Multiple microelectronics assembly centers, each optimized for different customer requirement sets including ITAR-registered, co-located with optical alignment and RF expertise, and lower-cost region
  • Microelectronic packaging capabilities for a wide range of ceramic and open-cavity plastic
    packages
  • Broad microelectronics bonding and attachment capabilities
  • Advanced testing capabilities including 2D and 3D x-ray inspection and failure analysis utilizing scanning electron microscopy
  • ISO 14644 appropriately rated clean rooms
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Micro-e capabilities

This video takes a look at Benchmark's micro-e capabilities.

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Ouster Case Study

Leading provider of high-resolution low-cost Lidar sensors was ready to scale production, they turned to Benchmark.

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