Benchmark Markets

Engineering, manufacturing, and technology solutions for markets that demand high-reliability.
Learn More

About

Our vision is to positively impact lives by solving complex challenges with our customers, creating innovative products that no one imagined were possible.
Learn More

Investors

Bridging the gap between innovation and marketability
Learn More

Connect

Your full solution partner of choice
Learn More
Lark TechnologyDiscover a different type of magicBuy now
Secure TechnologySecure lab tested technology, with battle-tested durability
Precision Technologies Hone in on agility and accuracy
Connected TechnologyDevelop custom connected devices

MICROELECTRONICS

Built To Perform,
Not Just To Print

In microelectronics assembly, there’s no room for error. That’s why we built our global microelectronics capabilities around cutting-edge production tools and highly experienced teams—allowing us to provide reliable, high-tech manufacturing and engineering solutions for the most highly regulated markets.

Markets Served

COMMERCIAL AEROSPACE
COMPLEX INDUSTRIAL
HIGH PERFORMANCE COMPUTING
DEFENSE
MEDICAL TECHNOLOGIES
NEXTGEN TELCO
MIXED AND HYBRID TECHNOLOGY MODULES AND ASSEMBLIES

Benchmark Phoenix site co-locates precision microelectronic assembly capabilities with design engineering and Surface Mount Technology (SMT) capabilities, overcoming your size, weight, and power (SWaP) challenges. We excel at developing microelectronics processes for RF systems, particularly at challenging millimeter-wave (mmWave) frequencies. On-site photonics expertise supports the development of photonics test, assembly, and packaging solutions. This combination makes Benchmark the partner of choice for mixed-technology applications in defense, telecommunications, and high-performance computing.

Sites are optimized for low-volume/high mix to medium-volume production. All sites offer numerous certifications and registrations.

ADVANCED CAPABILITIES
  • Microelectronics assembly, automation, and test engineering services from one provider
  • Microelectronic packaging capabilities for a wide range of ceramic and open-cavity plastic packages, including System-in-Package (SiP) applications
  • Broad microelectronics bonding and attachment capabilities
  • Customized automated processing for high production volumes
  • Advanced testing and failure analysis capabilities using 2D and 3D x-ray inspection and scanning electron microscopy
  • Precision optical alignment

Additional Resources

OUSTER LIDAR CASE STUDY

When a leading provider of high-resolution, low-cost lidar sensors was ready to scale, they turned to Benchmark.

LEARN MORE
HYBRID ASSEMBLY CASE STUDY

Benchmark improved yields on complex microelectronics and SMT assembly for aerospace and defense application.

LEARN MORE
ATOMIC CLOCK CASE STUDY

Benchmark helped our partner manufacture a groundbreaking miniaturized design.

LEARN MORE

Ready to tackle your smallest challenges?