14 March, 2023
Mixed technology modules are a key tool for achieving SWaP goals in high-reliability systems. Benchmark makes bringing these designs to reality easy and efficient by combining highly-capable microelectronics and Surface Mount Technology (SMT) assembly in one location.
We designed our facility for the rapid development and production of mixed and hybrid systems. For example, both our microelectronics and SMT lines offer flip-chip capabilities, allowing us to optimize for precision or speed as the application demands. You can select the best component for your system without the trade-offs of sending boards between multiple service providers or facilities.
Benchmark provides the capabilities to design and manufacture micro-e and SMT solutions that are practical and thoroughly tested for high reliability, supporting high-speed digital, RF, microwave, mmWave, optical, and mixed-signal circuits. Benchmark’s engineers have the experience to apply proven micro-e and SMT processes in a fully clean-room environment to meet challenging requirements for aerospace, defense, and industrial applications.
