Ready-to-Use Capabilities and Expertise

Liquid cooling is rapidly becoming the preferred means of thermal management for critical, High Performance Computers (HPCs) such as AI clusters, supercomputers, and government research systems. Liquid cooling increases an HPC's upper limit of performance, provides improved thermal efficiency, and offers better options for sustainability. However, testing, manufacturing, and scaling are challenging. With proven experience in liquid cooling and fully operational liquid cooling test and manufacturing infrastructure in the U.S., Benchmark can help you accelerate your time-to-deployment.

Jump down to:

Chapters at a glance

arrow left arrow right
Chapter 1

Highly Scalable Testing and Manufacturing

Chapter 2

Demonstrated Capabilities

Chapter 3

Seamless Integration and Flexibility

Chapter 1

Highly Scalable Testing and Manufacturing

Chapter 2

Demonstrated Capabilities

Chapter 3

Seamless Integration and Flexibility

Chapter 1

Highly Scalable Testing and Manufacturing

Our U.S.-based test and manufacturing grew from decades of building HPCs to fill U.S. government contracts. This heritage provided substantial expertise in multiple forms of HPC, including supercomputing. Our manufacturing record includes several of the current fastest supercomputers and multiple HPC systems on the Top500 supercomputer list. This experience positions us for an expanding range of projects deemed critical.

The high visibility of supercomputer deployments drives demanding deadlines, providing us with the opportunity to develop highly scalable testing and manufacturing methods. Testing, manufacturing, and production ramping of liquid-cooled computing assemblies is complex and typically requires implementing custom mechanical hardware, electronics, software, and security protocols. Benchmark has experience in each of these and can bring any or all of them to bear for your needs.

Chapter 2

Demonstrated Capabilities

  • Printed circuit board assembly (PCBA) places all components on large-format circuit boards
  • Full blade assembly places all circuit boards, cold plates, thermal interface material, wiring harnesses, and plumbing into the HPC blade
  • Functional-circuit testing (FCT) tests assembled blades under actual liquid-cooled conditions, allowing for maximum, high-performance system testing
  • Fluid purge testing checks the integrity of each blade's cooling channels and clears fluid from the channels before shipping
  • Test procedure development and design for test (DFT) both optimize test flows to dramatically cut test time without sacrificing the quality of test
  • Co-location of test development and manufacturing in the United States allows for end-market proximity and efficient engineering
  • Information security practices ensure the security and integrity of customer software, designs, firmware, and Benchmark's information systems
  • Facilities qualified with relevant certifications ensure all results meet applicable standards
Chapter 3

Seamless Integration and Flexibility

Benchmark's flexibility allows you to employ our capabilities for any part of your product lifecycle, and we work with your teams to ensure we integrate seamlessly into your existing processes. We also offer many specialized engineering capabilities that can enhance your product design with the convenience of a single product realization partner:

Related Case Study Content

Related Blog Content

Left Arrow Right Arrow

Benchmark is ready to help with your high-performance computing needs. Contact us today to discuss bringing your system to market faster.