Miniaturization Using High-Layer Count Liquid Crystal Polymer

Engineers have grappled with trade-offs between size and computing power for decades, making great strides in the process. One set of tools driving the next generation of smaller, more powerful electronics are high-density, high-layer count circuits. Liquid Crystal Polymer is emerging as a promising material for high-density circuits, particularly for high-frequency applications.

This paper describes the process for manufacturing high-density, high-layer count circuits In LCP and discusses some applications.

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