Miniaturization and
Microelectronics

Whether a medical device is worn on the body, implanted in the body or held in a care provider or patient’s hand, getting the size and shape of the device right is essential for effectiveness and patient comfort. Without the ability to miniaturize electronics, the size and shape of the electronics become the limiting factor in designs instead the of user's needs. In addition to the overall size of the electronics, the shape and ability to flex can have an impact on the final form factor of a device. Benchmark has multiple miniaturization and microelectronics methods at our disposal, allowing us to select the right tool for each engineering challenge. Benchmark Lark Technology’s expertise in microelectronics processes to create 3-Dimensional Heterogeneous Integrated (3DHI) circuits gives our engineers broad design options for miniaturization of circuits for medical devices, including re-partitioning designs to reduce the number of components required. Our specialty in Liquid Crystal Polymer (LCP) as a substrate for circuits 10+ layers thick is particularly valuable for medical devices as it is thin, light, flexible (in lower layer count circuits) and hermetically sealed.

In telecommunications, precision is just as important as overall reduced size. Placement of components with tolerances as tight as one micron is common in photonics applications, including complex new telecommunication components required for next-generation fiber backhaul supporting 5G. Benchmark has microelectronics capabilities in photonics, fiber optics and free space optics component and module manufacturing, including placement with tolerances below one micron. 5G also pushes the need for miniaturization in telecommunications equipment as 5G small cell antennas move into urban landscapes at a much higher density than 4G antennas. The ability to miniaturize small cell components allows these antennas to better blend into the landscape while offering more antennas per array. Use of 3-Dimensional Heterogeneous Integrated (3DHI) circuits built with materials optimized for RF design offers re-partitioning options that integrate RF antennas and compute functions even at mmWave frequencies, reducing size and increasing functionality of 5G components. Benchmark Lark Technology’s process creates RF filters, waveguides and amplifiers that are lightweight, low-power and a fraction of the size of conventional RF components, yet customizable for performance at any frequency up to 110 GHz.