microelectronics assembly

Combining our fabrication, materials and design expertise, Lark has become an industry leader in miniaturizing electronics for the military, aerospace and aviation, and medical industries. Our unique manufacturing and assembly capabilities allow for next-gen Size, Weight and Power (SWaP) reduction without performance loss, all within one location. Our process ensures reduced cost and time to market.

Lark offers microelectronic packaging capability for a wide range of ceramic and open-cavity plastic packages including:

  • Leadless
  • Fine Pitch
  • Ball Grid Array (BGA)
  • Pin Grid Array (PGA)
  • Land Grid Array (LGA)


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Lark RF Technology - A different Kind of Magic
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