15 April, 2022
Benchmark provides design expertise for high-performance circuit solutions that push the limits of what is possible in high-frequency and high-speed circuit design, covering analog signal frequencies to 110 GHz and multi-gigabit data rates.
Your circuit designs are developed with the latest computer simulation software at Benchmark’s RF and High-Speed Design Center of Innovation in Phoenix, AZ. The design center blends design, manufacturing, and test engineering teams to transform design concepts into solutions—quickly and cost-effectively. Beyond circuit and system design engineering, our integrated facility also offers microelectronics assembly, automated surface mount technology (SMT) assembly, system build, and functional RF test for assembly to the sub-system or system level. Performance is checked through all stages of development on precisely calibrated test instruments.
Selecting the right substrate and fabrication technology is key when designing antennas for E band.
Understand the process for manufacturing high-density, high-layer count circuits.
Mixed-material high-density interconnect circuits are helping system engineers achieve size, weight, and power goals.
