Semiconductor Capital Equipment

Wafer Processing

Over 30 years of experience

In today’s market, customers require greater reductions of size, weight and power (SWaP) as the industry’s demand for microelectronics increases. Wafer fabrication is one of the most complex manufacturing processes in the industry today, and ultra-thin wafers have compounded that complexity immensely.

To meet the requirements for micro and next-gen electronics, customers need to ensure the strategic partners they engage with have deep technical experience, as well as in-house equipment and capabilities to ensure high reliability, reduce cost and accelerate time-to-market.

Benchmark has more than 30 years of experience in the Semi-Cap market, amassing key innovations and technical resources to excel in wafer processing capabilities. Our experience also contributes to our mastery of the wafer processing environment.

Our key capabilities support:

  • Front-end Fab Processes Such as Lithography, Deposition, Etch, Anneal and Chemical Mechanical Planarization
  • Back-end Fab Processes, such as Inspection/Metrology and Packaging
  • Manufacturing Solutions Critical to Process Components and Assemblies
  • Wafer Processing Environment and Associated Stringent Requirements 
We meet customers' size weight and power needs.
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