In today’s market, customers require greater reductions of size, weight and power (SWaP) as the industry’s demand for microelectronics increases. Wafer fabrication is one of the most complex manufacturing processes in the industry today, and ultra-thin wafers have compounded that complexity immensely.
To meet the requirements for micro and next-gen electronics, customers need to ensure the strategic partners they engage with have deep technical experience, as well as in-house equipment and capabilities to ensure high reliability, reduce cost and accelerate time-to-market.
Benchmark has more than 30 years of experience in the Semi-Cap market, amassing key innovations and technical resources to excel in wafer processing capabilities. Our experience also contributes to our mastery of the wafer processing environment.
Our key capabilities support: