Benchmark Markets

Engineering, manufacturing, and technology solutions for markets that demand high-reliability.
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Our vision is to positively impact lives by solving complex challenges with our customers, creating innovative products that no one imagined were possible.
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SPACE SYSTEMS

Meeting the Demands of Extreme Space

Benchmark is a true partner to space system innovators like you, balancing innovative technology with decades of experience building to stringent standards. We know space applications demand high-performance electronics and RF Systems that perform under extreme temperature, weight, radiation, and pressure constraints. That’s why Benchmark provides technology solutions, engineering services, and advanced manufacturing to overcome your space challenges while meeting a range of certification requirements.  

From engineering design strategies that optimize size, weight, power, and cost (SWaP-C) to hybrid SMT and bare-die assemblies that meet the most stringent reliability standards, Benchmark is the perfect strategic partner for government and commercial space application innovators.  

From Hybrid Assemblies to System Builds

Space products must address more potential points of failure than nearly any other electronics application. Because we house design, manufacturing, and test support internally, we’re able to reduce risk between development stages. Benchmark has the tools and experience to address challenges ranging from reliability predictions and radiation modeling to certification of individual commercial off-the-shelf (COTS) components. When combined, our cutting-edge technology solutions solve SWaP-C challenges common in space applications. Benchmark also offers expert system build services for a one-partner circuit-to-system solution.

ADVANCED CAPABILITIES
  • Optimize SWaP-C in materials for extreme conditions of space
  • Design and layout of high density interconnect circuits for signal integrity for RF systems
  • Hybrid SMT and micro-e assembly, including embedded components and bare-die placement
  • Radiation modeling and analytics, reliability predictions, and radiation hardening
  • Extensive integrated functional test and environmental stress screening (ESS) development
  • U.S.-based manufacturing to IPC Class-3 standards with IPC Class-J certified operators
  • RF systems up to 110 GHz

Markets Served

Nextgen Telco
Commercial Aerospace
Defense

Additional Resources

HYBRID ASSEMBLY CASE STUDY

An industry-leading technology company partnered with Benchmark to improve yields on a complex hybrid microelectronics and SMT assembly for high-reliability applications.

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ATOMIC CLOCK CASE STUDY

The DARPA has been proactive in sponsoring atomic-clock miniaturization exploration since 2005, coinciding with dynamically evolving use cases where accuracy...

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