Lark is a leader in advanced liquid crystal polymer (LCP) next-gen manufacturing methods for the miniaturization of printed circuit boards. Using LCP and our breakthrough high-speed processes, we can offer a revolutionary dimensional board space reduction average of 60%, a maximum board reduction of 1/10th the original size and performance up to 100 GHz. Our LCP manufacturing takes place at our newly built RF and High-Speed Design Center of Innovation in Phoenix, where we offer prototyping and design services, substrate and packaging technologies, mixed microelectronics and complex product assembly and test, all at one location. We are the leading provider in the United States that can develop and manufacture LCP for the needs of the RF, 5G, high frequency and defense markets.
Liquid crystal polymer is an unusual material with unique properties that are particularly good for microwave frequency electronics due to low relative dielectric constants, low dissipation factors, and commercial availability of laminates. LCP technology is the future of circuit design and manufacturing for high-performance electronics.
To our knowledge, no other company can compete with or attain our LCP manufacturing milestones. Our methods accomplish 15+ layers of LCP (other manufacturers max out at 5) and one mil lines and spaces in circuit traces, allowing us to support 5G and next-gen telco designs. These technical milestones enable us to set the state-of-the-art worldwide standard for LCP manufacturing. Our LCP manufacturing advances create a significant reduction in size, weight and power (SWaP) while supporting new electronics designs in military, commercial, and medical markets that demand performance from 10 GHz to 100 GHz.
Our unique approach to manufacturing LCP for circuits leverages conventional processes but overcomes the historical challenges of working with LCP. LCP’s multiple benefits allow next generation SWaP reduction for a wide range of electronics, IoT sensors and edge devices. Benefits include conveniently burying bare dies, components, and circuit lines inside layers of a LCP printed circuit board substrate, and creating a significant reduction in the electronics-packaging footprint while maintaining a high electronic density.