Lark maintains market leadership in Size Weight and Power (SWaP) reduction by applying innovative fabrication methods that achieve the industry’s smallest circuit lines and spaces. Our process is material agnostic, so we can customize our approach to each and every customer’s need and suggest the correct substrates that provide the highest performance. We can also solve a number of complex design challenges such as insertion loss, id tangent and rolled copper. Our differentiating capabilities are achieved through unique, next-gen manufacturing methods.
Our capabilities include: