The modern military collects and uses data like never before, letting commanders leave little to chance and improving lethality and survivability. But there is still a long way to go before fully-connected, multi-domain operations reach the full promise of a connected battlespace. Technology challenges and manufacturing limitations have been headwinds to the connected battlespace for too long. Benchmark partners with defense companies to solve your technology challenges, develop unique manufacturing processes, and ultimately make the connected battlespace of the future a reality.
Our joint design development model gives customers access to the expertise needed to get their product built. Whether you need RF systems expertise to optimize a design, very high density interconnect circuit design expertise to miniaturize electronics, or test development skills to allow your team to focus on the next project, Benchmark’s engineers take a consultative approach to help you iterate to get to a better solution faster. We can help you address size, weight, and power (SWaP) considerations at the circuit through system level.
We meet your complex requirements with secure and integrated U.S.-based solutions. Connected battlespace applications leverage hybrid assemblies, mixed technologies, and precision manufacturing of products with low design margins. Benchmark has invested in vertically-integrated circuit fabrication, microelectronics assembly, surface mount technology assembly, system build, and test capabilities to deliver the next generation of connected battlespace technology. With more than 40 years’ experience delivering advanced technology to defense partners, Benchmark recognized the imperative of advanced manufacturing capabilities within the U.S. at ITAR-registered facilities, including some with COMSEC and KILF accounts.
Delivering fully integrated solutions for mission-critical applications designed to protect those in harm’s way.
Development of a secure wireless sensor network for data collection and dissemination in a signal-congested environment.
Mixed-material high-density interconnect circuits are helping defense systems engineers achieve size, weight, and power goals.