RF & HIGH SPEED CIRCUIT DESIGN

RF AND HIGH-SPEED CIRCUIT DESIGN AND FABRICATION

Benchmark Lark Technology provides high-performance circuit solutions that push the limits of what is possible in high-frequency and high-speed circuit design, covering analog signal frequencies to 110 GHz and multi-gigabit data rates.

STATE OF THE ART MANUFACTURING PROCESSES

Using a modified semi-additive manufacturing process, we fabricate ultra high density interconnect (UHDI) circuits with 25-micron features and 10+ layers with complex circuit topologies such as blind and buried vias. Our process is substrate-agnostic, and we can work with you to identify optimal materials for your application. By combining materials, we can help you integrate digital, and RF functions on a single circuit, reducing the overall number of boards in your system for additional size, weight, and power reduction. Processes conform to IPC Class-3.

RF and High-Speed Design Center of Innovation

Your circuit designs are developed with the latest computer simulation software and produced with some of the world’s most advanced circuit fabrication equipment at Lark’s RF and High-Speed Design Center of Innovation in Phoenix, AZ. The design center blends design, production, and test engineering teams to transform design concepts into solutions—quickly and cost-effectively. Beyond circuit fabrication, our integrated facility also offers microelectronics assembly, automated surface mount technology (SMT) assembly, system build, and functional RF test for assembly to the sub-system or system level. Performance is checked through all stages of development on precisely calibrated test instruments.

Cutting-Edge Circuit Design Capabilities

Ultra high density interconnect (UDHI) circuits with features down to 25 μm
Size, weight, and power (SWaP) optimization
RF frequency performance up to 110 GHz
High-performance circuit materials to match performance and cost requirements, including hybrid mixed material multilayer PCBs
Multilayer circuits with embedded components
Extensive thermal analysis and management capabilities for increased power density
RF/microwave testing, troubleshooting, and tuning
Automated analog testing (signal generation and analysis) to 110 GHz
Strategic co-location of circuit design and fabrication with microelectronics, SMT assembly, and RF test
ITAR-registered

Resources

DESIGNING FOR E BAND ANTENNAS

Selecting the right substrate and fabrication technology is key when designing antennas for E band.

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MINIATURIZATION USING HIGH-LAYER COUNT LIQUID CRYSTAL POLYMER

Understand the process for manufacturing high-density, high-layer count circuits.

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MIXED SIGNAL CIRCUITS WHITE PAPER

Mixed-material high-density interconnect circuits are helping system engineers achieve size, weight, and power goals.

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RF & HIGH SPEED CIRCUIT DESIGN

RF AND HIGH-SPEED CIRCUIT DESIGN AND FABRICATION

STATE OF THE ART MANUFACTURING PROCESSES

RF and High-Speed Design Center of Innovation

Cutting-Edge Circuit Design Capabilities

Resources

DESIGNING FOR E BAND ANTENNAS

MINIATURIZATION USING HIGH-LAYER COUNT LIQUID CRYSTAL POLYMER

MIXED SIGNAL CIRCUITS WHITE PAPER

Do you have a need for speed?

Navigate

Subscribe to the Benchmark blog

Recent Posts

Benchmark Markets

About

Investors

Connect

Precision Technologies

Connected Device Technology

Advanced Technology

RF & HIGH SPEED CIRCUIT DESIGN

RF AND HIGH-SPEED CIRCUIT DESIGN AND FABRICATION

STATE OF THE ART MANUFACTURING PROCESSES

RF and High-Speed Design Center of Innovation

Cutting-Edge Circuit Design Capabilities

Resources

DESIGNING FOR E BAND ANTENNAS

MINIATURIZATION USING HIGH-LAYER COUNT LIQUID CRYSTAL POLYMER

MIXED SIGNAL CIRCUITS WHITE PAPER

Do you have a need for speed?

Navigate

Subscribe to the Benchmark blog

Subscribe to Setting the Benchmark blog

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