Benchmark Markets

Engineering, manufacturing, and technology solutions for markets that demand high-reliability.
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Our vision is to positively impact lives by solving complex challenges with our customers, creating innovative products that no one imagined were possible.
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Bridging the gap between innovation and marketability
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Your full solution partner of choice
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Lark TechnologyDiscover a different type of magicBuy now
Secure TechnologySecure lab tested technology, with battle-tested durability
Precision Technologies Hone in on agility and accuracy
Connected TechnologyDevelop custom connected devices
Advanced TechnologyAccess tomorrow's technology today
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HIGH SPEED Circuit DESIGN and fabrication

Benchmark Lark Technology is a leader in a wide range of capabilities focused on innovating in the high-performance electronics market. We can customize any solution to fit your needs. Our capabilities are centered around our new RF and High Speed Design Center of Innovation in Phoenix, Arizona. It’s the first facility in the world where customers have access to prototyping and design services, SMT and microelectronics assembly, HDI substrate design and fabrication and integrated manufacturing and testing processes, all in one streamlined location.

Lark maintains market leadership in Size Weight and Power (SWaP) reduction by applying innovative fabrication methods that achieve the industry’s smallest circuit lines and spaces. Our process is material agnostic, so we can customize our approach to each and every customer’s need and suggest the correct substrates that provide the highest performance. We can also solve a number of complex design challenges such as insertion loss, id tangent and rolled copper. Our differentiating capabilities are achieved through unique, next-gen manufacturing methods.

 Our design and fabrication capabilities include:

  • Circuit lines and spaces of sub-25 microns with tuned performance
  • High-frequency circuits up to 110 GHz
  • Board layers up to 10 times thinner than conventional PCBs due to thinner dielectrics
  • Material set agnostic fabrication processes and mixed material PCBs
  • Unique capabilities in multi-layer (10+layers) Liquid Crystal Polymer boards
  • Circuit board space reduction of up to 60%, with a maximum of 1/10th the original size

These design and fabrication capabilities allow us to excel in:

The global leader in ultra-HDI circuits 
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