Benchmark Markets

    Engineering, manufacturing, and technology solutions for markets that demand high-reliability.
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    About

    Our vision is to positively impact lives by solving complex challenges with our customers, creating innovative products that no one imagined were possible.
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    Investors

    Bridging the gap between innovation and marketability
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    Connect

    Your full solution partner of choice
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    Precision Technologies

    From analytics to prototypes, precision engineering to production, assembly to supply chain management, our global team provides premier experience and complex machining.
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    Connected Device Technology

    A flexible development team for connected devices that collect relevant, reliable data for smart city, medical, and complex industrial applications.
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    Lark TechnologyDiscover a different type of magicBuy now
    Secure TechnologySecure lab tested technology, with battle-tested durability
    Precision Technologies Hone in on agility and accuracy
    Connected TechnologyDevelop custom connected devices

    RF & HIGH SPEED CIRCUIT DESIGN

    RF AND HIGH-SPEED CIRCUIT DESIGN

    Benchmark Lark Technology provides design expertise for high-performance circuit solutions that push the limits of what is possible in high-frequency and high-speed circuit design, covering analog signal frequencies to 110 GHz and multi-gigabit data rates.

    RF and High-Speed Design Center of Innovation

    Your circuit designs are developed with the latest computer simulation software at Lark’s RF and High-Speed Design Center of Innovation in Phoenix, AZ. The design center blends design, manufacturing, and test engineering teams to transform design concepts into solutions—quickly and cost-effectively. Beyond circuit and system design engineering, our integrated facility also offers microelectronics assembly, automated surface mount technology (SMT) assembly, system build, and functional RF test for assembly to the sub-system or system level. Performance is checked through all stages of development on precisely calibrated test instruments.

    Cutting-Edge Circuit Design Capabilities

    • Design of high density interconnect (HDI) circuits utilizing the latest in 3-dimensional design strategies to optimize size, weight, and power (SWaP) as well as RF signal integrity
    • Experience designing for High-performance circuit materials to match performance and cost requirements
    • Extensive thermal analysis and management capabilities for increased power density
    • RF/microwave testing, troubleshooting, and tuning
    • Automated analog testing (signal generation and analysis) to 110 GHz
    • Strategic co-location of circuit design with microelectronics, SMT assembly, and RF test
    • ITAR-registered

    Resources

    DESIGNING FOR E BAND ANTENNAS

    Selecting the right substrate and fabrication technology is key when designing antennas for E band.

    ACCESS THE PAPER
    MINIATURIZATION USING HIGH-LAYER COUNT LIQUID CRYSTAL POLYMER

    Understand the process for manufacturing high-density, high-layer count circuits.

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    MIXED SIGNAL CIRCUITS WHITE PAPER

    Mixed-material high-density interconnect circuits are helping system engineers achieve size, weight, and power goals.

    ACCESS THE PAPER

    Do you have a need for speed?

    Our mission is to be our customers’ trusted partner; providing comprehensive solutions across the entire product lifecycle; leading through our innovative technology and engineering design services; leveraging our optimized global supply chain; and delivering world-class manufacturing services.

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