Benchmark Markets

Engineering, manufacturing, and technology solutions for markets that demand high-reliability.
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Our vision is to positively impact lives by solving complex challenges with our customers, creating innovative products that no one imagined were possible.
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Bridging the gap between innovation and marketability
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Lark TechnologyDiscover a different type of magicBuy now
Secure TechnologySecure lab tested technology, with battle-tested durability
Precision Technologies Hone in on agility and accuracy
Connected TechnologyDevelop custom connected devices
Advanced TechnologyAccess tomorrow's technology today

RF & HIGH SPEED CIRCUIT DESIGN

RF AND HIGH-SPEED CIRCUIT DESIGN AND FABRICATION

Benchmark Lark Technology provides high-performance circuit solutions that push the limits of what is possible in high-frequency and high-speed circuit design, covering analog signal frequencies to 110 GHz and multi-gigabit data rates.

STATE OF THE ART MANUFACTURING PROCESSES

Using a modified semi-additive manufacturing process, we fabricate ultra high density interconnect (UHDI) circuits with 25-micron features and 10+ layers with complex circuit topologies such as blind and buried vias. Our process is substrate-agnostic, and we can work with you to identify optimal materials for your application. By combining materials, we can help you integrate digital, and RF functions on a single circuit, reducing the overall number of boards in your system for additional size, weight, and power reduction. Processes conform to IPC Class-3.

RF and High-Speed Design Center of Innovation

Your circuit designs are developed with the latest computer simulation software and produced with some of the world’s most advanced circuit fabrication equipment at Lark’s RF and High-Speed Design Center of Innovation in Phoenix, AZ. The design center blends design, production, and test engineering teams to transform design concepts into solutions—quickly and cost-effectively. Beyond circuit fabrication, our integrated facility also offers microelectronics assembly, automated surface mount technology (SMT) assembly, system build, and functional RF test for assembly to the sub-system or system level. Performance is checked through all stages of development on precisely calibrated test instruments.

Cutting-Edge Circuit Design Capabilities

  • Ultra high density interconnect (UDHI) circuits with features down to 25 μm
  • Size, weight, and power (SWaP) optimization
  • RF frequency performance up to 110 GHz
  • High-performance circuit materials to match performance and cost requirements, including hybrid mixed material multilayer PCBs
  • Multilayer circuits with embedded components
  • Extensive thermal analysis and management capabilities for increased power density
  • RF/microwave testing, troubleshooting, and tuning
  • Automated analog testing (signal generation and analysis) to 110 GHz
  • Strategic co-location of circuit design and fabrication with microelectronics, SMT assembly, and RF test
  • ITAR-registered

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