Benchmark Lark Technology provides high-performance circuit solutions that push the limits of what is possible in high-frequency and high-speed circuit design, covering analog signal frequencies to 110 GHz and multi-gigabit data rates.
Using a modified semi-additive manufacturing process, we fabricate ultra high density interconnect (UHDI) circuits with 25-micron features and 10+ layers with complex circuit topologies such as blind and buried vias. Our process is substrate-agnostic, and we can work with you to identify optimal materials for your application. By combining materials, we can help you integrate digital, and RF functions on a single circuit, reducing the overall number of boards in your system for additional size, weight, and power reduction. Processes conform to IPC Class-3.
Your circuit designs are developed with the latest computer simulation software and produced with some of the world’s most advanced circuit fabrication equipment at Lark’s RF and High-Speed Design Center of Innovation in Phoenix, AZ. The design center blends design, production, and test engineering teams to transform design concepts into solutions—quickly and cost-effectively. Beyond circuit fabrication, our integrated facility also offers microelectronics assembly, automated surface mount technology (SMT) assembly, system build, and functional RF test for assembly to the sub-system or system level. Performance is checked through all stages of development on precisely calibrated test instruments.