Advances in software capabilities—artificial intelligence and machine learning, to name a few—continue to drive the need for edge computing power. Real-world edge computing applications can often be limited to a size-constrained space in drones, satellites, or autonomous vehicles. Circuits are becoming more complex to meet this need as they must fit ever-smaller spaces in commercial, industrial, and military applications.
Engineers are thinking about space differently, as new manufacturing techniques allow them to take advantage of vertical space by increasing circuit layers and stacking functionality. Eliminating an entire board by combining functions into mixed-signal circuits is an ideal strategy for extreme size, weight, and power (SWaP) constraints. Higher levels of integration ensure more functionality in smaller circuits with fewer interconnections and potential failure points.
In our white paper, Manufacturing Miniature PCBs for Mixed-Signal Circuits, we examine the requirements for achieving proper isolation and high reliability for densely packed multifunction PCBs and offer detailed guidance for substrate characterization, electrical performance, and inspection and test methods for multi-layer, highly dense circuits. Download the full white paper to learn more.