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Manufacturing Miniature PCBs for Mixed-Signal Circuits

by Kevin Walker / April 13, 2021

Advances in software capabilities—artificial intelligence and machine learning, to name a few—continue to drive the need for edge computing power. Real-world edge computing applications can often be limited to a size-constrained space in drones, satellites, or autonomous vehicles. Circuits are becoming more complex to meet this need as they must fit ever-smaller spaces in commercial, industrial, and military applications.

Engineers are thinking about space differently, as new manufacturing techniques allow them to take advantage of vertical space by increasing circuit layers and stacking functionality. Eliminating an entire board by combining functions into mixed-signal circuits is an ideal strategy for extreme size, weight, and power (SWaP) constraints. Higher levels of integration ensure more functionality in smaller circuits with fewer interconnections and potential failure points.

In our white paper, Manufacturing Miniature PCBs for Mixed-Signal Circuits, we examine the requirements for achieving proper isolation and high reliability for densely packed multifunction PCBs and offer detailed guidance for substrate characterization, electrical performance, and inspection and test methods for multi-layer, highly dense circuits. Download the full white paper to learn more.

Access the White Paper

Manufacturing RF & Miniaturization Benchmark Lark Technology Engineering

about the author

Kevin Walker

Kevin Walker is Benchmark Lark Technology’s High-Frequency Interconnect Jedi. He grows our RF & High-Speed Circuits business, working closely with our customers, sales, marketing, program management, and engineering teams. Kevin has a Bachelor of Science in Engineering and over 30 years of diverse interconnect industry experience. He introduced Liquid Crystal Polymer (LCP) substrate materials to our industry while in a leadership role at Rogers, and developed LCP based circuit applications as General Manager of Micro Systems Technologies. His experience ranges from thin film microwave circuit fabrication and high speed/microwave circuit materials, to commercial microwave circuit fabrication and assembly, implantable medical device assembly, and military microwave interconnect products.