AUSA Annual Meeting

  • October 14-16, 2019
  • Washington, D.C.
  • Walter E. Washington Convention Center
  • Booth 443

Benchmark combines all of its capabilities to offer our customers design for excellence, size, weight, power and thermal management optimization, processes and building blocks that increase their ability to achieve higher requirements in a shorter time to market.  We're driving innovation for critical industry needs in miniaturization, computing power, communication optimization and sensor integration.   

The cutting-edge solutions that will be on display include:

  • Low power wireless development kit designed for rugged, harsh and noisy environments that enables wireless audio, wireless data, mesh networking, and location tracking in mobile environments. The device can’t be interfered with nor does it interfere with other wireless/wired systems.
  • Leading Liquid Crystal Polymer (LCP) technology for miniaturizing product design, including avionic and mission control systems.
  • Printed circuit boards with embedded cooling for temperature stabilization in a densely packed electronic environment.
  • Technology platforms that integrate data from multiple surveillance and tracking solutions to provide complete situational awareness in areas with or without physical barriers.
  • Micro-electronics and mixed technology capabilities in engineering and manufacturing.
Schedule a meeting with our Leadership at the show to find out why so many companies turn to Benchmark when it matters.
Find out what Benchmark can do for you.
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