The F/A Lab performs failure analysis on electronic devices,
components, and assemblies. We excel at failure mode analysis and
root cause determination. Once we determine the root cause, we then
produce a list of recommendations in order to aid the customer in
making sure the problem does not reoccur. Failure analysis in the
areas of electronics and materials are routinely performed. All F/A
Lab Services include a professionally written Lab Report.
Laboratory Services Overview
The F/A Laboratory’s microsectioning procedure involves careful selection,
preconditioning, mounting in acrylic or epoxy resin materials, low deformation
planar grinding using silicon-carbide (120, 240, 320, 400, and 600 grits)
papers, multiple polishing steps (6, 1, and .05 micron suspensions). When
required, we use chemical etching methods to accentuate the sample’s area of
interest.
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Optical Microscopy at the F/A Lab is often coupled with digital imaging and
analysis. We perform dimensioning, annotation, archiving and standardized
inspections. We specialize in bright field illumination and metallic contrast
imaging using a Metallurgical microscope. Using this and various forms of
optical microscopy, we examine components, circuit boards, solder,
microstructure morphologies, contamination, defects, and anomalies of electronic
materials at 2 to 1000 times magnification.
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Scanning Electron
Microscopy (SEM) w/ Energy Dispersive Spectroscopy (EDS)
The F/A Lab resolves metallic and ceramic-based specimens to approximately
10,000X using Scanning Electron Microscopy. Our SEM laboratory service performs
imaging, contamination identification, fracture surface analysis, cross section
analysis, diffusion and metallurgical analysis, measurements and dimensioning,
and elemental mapping. Our state of the art EDS software accurately quantifies
most inorganic materials used in the electronics industry.
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- Crystal testing from 1 to 60MHz.
- Bench testing of small-scale analog or digital circuits.
- Curve tracer testing.
- AC & DC HyPot testing of transformers and inductors
- Capacitor leakage testing
- AC testing of passive component. Including inductance, capacitance and
resistance
- Other tests as needed (limited by specifications of available test
equipment).
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Solderability is vital to producing quality electronic assemblies. The F/A
Lab performs quantitative solderability testing as well as qualitative
dip-and-look tests. The test can be performed on leaded components, chip
components, wires, and coupons, with the results compared to established
evaluation standards such as the J-STD 002 and 003.
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The F/A Lab performs Ion Chromatography (IC) on electronic assemblies. This
technique is used to measure cleanliness of electronic assemblies, components,
and bare boards with precision. IC can determine the precise amount of F, Cl,
Br, NO2, NO3, PO4, and SO4 down to Parts Per Billion. The F/A lab can perform
bulk or select extractions on assemblies, components, and bare boards using
industry standard techniques.
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X-Ray Fluorescence measures the thickness and composition of tin-lead plating
and the thickness of gold over nickel over copper on PC Boards using an X-ray
Fluorescence Machine.
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Solder paste attributes are critical for consistent assembly. We can test for
Viscosity, Slump Spread, Solder Balls and Tackiness using test methods
IPC-TM-650-2.4.44 and others.
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- BGA Analysis
- Micro Hardness Testing
- Film Hardness by Pencil Test
- X-Ray Radiography
- Gross Leak Testing of Hermetic seals
- Design of Experiment Support Services
- Thermocoupling
- Shear and Pull testing
- Decapsulation
- HALT/HAAS Coordination
- Dye Penetrant Analysis
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