Manufacturing Engineeringng

Manufacturing Engineering

  • Integrated Global Design Centers
  • Design for Excellence (DFX)
    • Design for Manufacturability
    • Design for Test
    • Design for Cost
    • Design for Quality
  • World-class Test & Automation Services
    • Develop Wireless, High Frequency & Optical Test
    • Develop Environmental Test Systems
  • Failure Analysis Lab
Technology Capabilities

Technology Capabilities

  • Smallest Part – 0201, Smallest Leaded Pitch – 12 mil
  • R&D to Implement 01005 Parts
  • Largest BGA – 55mm x 55mm (up to 4000 ball count)
  • Automatic BGA Placement up to 2015 I/O Pins on a 1 mm Pitch
  • PCA Mfg. – 24” x 32” x .25 x 18 lb (up to 40” wide)
  • Network Interface Cards (NIC)
  • Ball Grid Array, µBGA Assembly
  • Chip on Board
  • Flip Chip
  • Component Programming
World-class Manufacturing

World-class Manufacturing

  • Global Business System Architecture
  • Quick-turn Prototyping
  • Cleanroom Capabilities
  • Automated Cleaning Solutions
  • Low/Medium/High Complexity PCBA Assembly
  • Robotic Assembly & Soldering
  • Hot Bar Soldering
  • High Melting Point Soldering
  • RF Assembly and Test
  • In-circuit & Functional Test
  • Box Build & System Integration
  • Precision Electromechanical Assembly
  • Complete Product Assembly
  • Fiber Optics Assembly & Test
  • Flex Circuit Assembly & Test
  • Radio Frequency, Wi-Fi, ZigBee, Cellular, Bluetooth & Microwave Test
  • Optical Component & Module Assembly
  • Ultrasonic Welding
  • Electron Beam & Laser Welding
  • Automated Solder Paste Inspection
  • Automated Optical Inspection
  • Automated 2D & 3D X-Ray
  • Automated Conformal Coating & Potting
  • Best-in-class Traceability & Genealogy System
  • World-class Process Control & Data Collection
Supply Chain Services

Supply Chain Services

  • Full Turnkey End-to-End Supply Chain Management
  • Global Supplier Contracts
  • Global Purchase Agreement Negotiation
  • Corporate Supply Chain Development
  • Component Lifecycle Monitoring
  • Market Trend Analysis
  • Demand Replenishment
  • Configure-to-order/Build-to-order Process
  • Retail Packaging
  • Worldwide Direct Order Fulfillment
  • Refurbishment & Upgrades/Depot Repair
  • Warranty Repair
  • Post-delivery Support
  • Hubbing
  • Merge-in-transit